Beyond 2nm: Apple’s A20 chip to introduce new packaging breakthrough

Apple is planning to overhaul its chip design for the 2026 iPhones, in a move that could mark the first time it uses advanced multi-chip packaging in a mobile device. It sounds complicated, but here’s what this means. According to analyst Jeff Pu in a new report for GF Securities, the iPhone 18 Pro, 18 Pro Max, and the long-rumored iPhone 18 Fold are expected to debut Apple’s A20 chip, built on TSMC’s second-gen 2nm process (N2). But that’s only part of the story. The more interesting bit is how those chips will be assembled. How those chips will be assembled For the first time, Apple is set to adopt Wafer-Level Multi-Chip Module (WMCM) packaging for its iPhone processors. WMCM allows different components, like the SoC and DRAM, to be integrated directly at the wafer level, before being diced into individual chips. It uses a technique that connects the dies without needing an interposer or substrate, which can bring both thermal and signal integrity benefits. If you have no idea ... Read full article.