Qualcomm's next-gen Snapdragon X chips could pack 18 Oryon V3 CPU cores to challenge AMD and Intel

Rumor mill: Laptops powered by Qualcomm's first-generation Snapdragon X chipsets may have received a somewhat lukewarm response from consumers, but the company has big plans for the PC market this year. The chipmaker's Snapdragon X2 processors will reportedly feature up to 50 percent more CPU cores than their predecessors and employ a new System-in-Package (SiP) configuration whereby the memory and storage will be folded into a single package. According to German tech blog WinFuture, Qualcomm's Snapdragon X2 SoCs will ship with up to 18 Oryon V3 cores, which is 50 percent more than the 12 cores offered by the flagship first-generation Snapdragon X Elite for PCs. The new cores will be more powerful than the current generation, potentially making the chips better at handling both single-threaded and multi-threaded applications. The report adds that the next-generation Snapdragon X chips will employ an SiP design that includes memory and storage in a single package. That means the flags ... Read full article.