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31.
China drafts $295 billion plan to build national AI data center grid running on 80% homemade silicon — projected 2028 timeline could run into limits of local chip production (tomshardware.com)
32.
AMD's Helios MI455X AI platform breaks cover, initial systems use UALink-over-Ethernet interconnects — AMD's Vera Rubin rival surfaces, but the downsides of Ethernet could hamstring performance (tomshardware.com)
33.
Frore shows off LiquidJet Nexus coldplate for Nvidia Vera Rubin, other AI accelerators — offers up claimed 10% token generation boost over rival liquid-cooling solutions (tomshardware.com)
34.
Astera Labs showcases 320-lane PCIe 6.0 switch for vendor-agnostic scaling in data centers — up to 80 accelerators can be scaled up using PCIe alone (tomshardware.com)
35.
SK hynix unveils 'iHBM' thermal architecture that cools AI memory at the source — integrated cooling elements inside HBM interface cut thermal resistance by 30%, target next-gen HBM5 accelerators and dense AI data centers (tomshardware.com)
36.
Jensen says Nvidia now has 'zero percent' market share in China — says US export policy 'has already largely backfired' (tomshardware.com)
37.
Samsung and SK hynix warn AI-driven memory shortages could last until 2027 and beyond, as HBM demand explodes — customers already reserving supply years ahead, while the wider DRAM market begins to tighten (tomshardware.com)
38.
Inside Google's TPU V8 strategy, delivering two chips for two crucial tasks at incredible scale — network scales up to 1 million TPUs per cluster, an advantage over Nvidia AI accelerators (tomshardware.com)
39.
TSMC's details next-gen CoWoS roadmap: over 14-reticle packages and 48x leap in compute power expected by 2029 — massive size enables 24 HBM5E stacks and additional memory bandwidth jump (tomshardware.com)
40.
SpaceX says it is going to begin manufacturing GPUs — $1.75 trillion IPO listing reportedly includes in-house GPU production (tomshardware.com)
41.
Meta commits to 1 gigawatt of custom chips with Broadcom as Hock Tan decides to leave board (cnbc.com)
42.
Meta commits to 1 gigawatt of custom chips with Broadcom as Hock Tan agrees to leave board (cnbc.com)
43.
Meta commits to one gigawatt of custom chips with Broadcom as Hock Tan agrees to leave board (cnbc.com)
44.
Intel and SambaNova team up on heterogenous AI inference platform — different hardware performs different workloads (tomshardware.com)
45.
Memory will consume 30% of hyperscaler AI data center spending this year, a 4X increase over 2023 — Nvidia gets preferential supply terms well below standard market rates, says analyst firm (tomshardware.com)
46.
Why Nvidia just poured $2 billion into AI ASIC competitor Marvell — NVLink Fusion turns into soft ecosystem lock-in (tomshardware.com)
47.
Ollama adopts MLX for faster AI performance on Apple silicon Macs (9to5mac.com)
48.
US gov't revokes controversial AI hardware export rule that would mandate investments from foreign companies — new export rules are still in the works, though (tomshardware.com)
49.
FLASH radiotherapy's bold approach to cancer treatment (news.ycombinator.com)
50.
UALink roadmap plots course to optimized AI data center interconnects — examining the open standard designed to combat vendor lock-in while offering cost and performance optimization (tomshardware.com)
51.
HetCCL makes clustered Nvidia and AMD AI accelerators play nice with each other via RDMA — vendor-agnostic collective communications library removes an obstacle to heterogeneous AI data centers (tomshardware.com)
52.
Nvidia reportedly boosts Vera Rubin performance to ward hyperscalers off AMD Instinct AI accelerators — increased boost clocks and memory bandwidth pushes power demand by 500 watts to 2300 watts (tomshardware.com)
53.
Furiosa: 3.5x efficiency over H100s (news.ycombinator.com)
54.
SK hynix shows 16-Hi HBM4 memory for AI accelerators — 48 GB at 10 GT/s over a 2,048 interface (tomshardware.com)
55.
AMD touts Instinct MI430X, MI440X, and MI455X AI accelerators and Helios rack-scale AI architecture at CES — full MI400-series family fulfills a broad range of infrastructure and customer requirements (tomshardware.com)
56.
Here’s why visiting museums between Christmas and New Year’s makes me a better leader (feeds.feedburner.com)
57.
Huawei's AI chip capabilities still pale in comparison to American silicon — report from U.S. council details that despite fears, Nvidia continues to lead by a wide margin (tomshardware.com)
58.
The RAM pricing crisis has only just started, Team Group GM warns — says problem will get worse in 2026 as DRAM and NAND prices double in one month (tomshardware.com)
59.
China's hybrid-bonded AI accelerators could rival Nvidia's Blackwell GPUs — top semiconductor expert hints at 'fully controllable domestic solution' (tomshardware.com)
60.
AMD's Linux kernel patches suggest enablement of next-gen Instinct MI400-series AI GPU accelerators (tomshardware.com)
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