GoKawiil
Tech News
Prominent hardware leaker Kopite7Kimi says Nvidia's next-generation RTX 60 series, built on the Rubin architecture, won't launch until 2028 at the earliest, later than the previously rumored late-2027 window. Nvidia declined to comment, saying it doesn't discuss rumors or unannounced products.
Speaking at a UK summit alongside King Charles III, Nvidia CEO Jensen Huang predicted the company would sell twice as many chips in the coming year compared to this year. This follows Nvidia's recent guidance of roughly 70% revenue growth for its fiscal year ending January 2028, reaching about $673 billion, a figure that already pushed analyst estimates higher.
Leaker Kepler_L2 says most of Nvidia's next-gen RTX 60 series and AMD's RDNA 5-based Radeon 10000 lineup won't launch until 2028, with AMD's midrange AT2 chip as the sole exception still on track for 2026. The claim contradicts an earlier report from Moore's Law is Dead suggesting Nvidia's RTX 6090 could arrive in early 2027, and AMD board partners have reportedly given inconsistent timelines ranging from late 2027 to early 2028.
Anthropic has agreed to a six-year, roughly $45 billion deal with British infrastructure firm Nscale to secure AI compute capacity, according to a source familiar with the matter. The capacity will run on Nvidia's new Vera Rubin chip system and come from Nscale's data center in West Virginia, with power expected online in late 2027.
Anthropic has agreed to a roughly $45 billion cloud computing arrangement with Nscale, a UK-based AI infrastructure firm, to lease about 460 megawatts of capacity at a planned West Virginia data center. The facility, expected to go live by late 2027, will run on Nvidia's upcoming Vera Rubin chips and adds to a string of recent infrastructure agreements Anthropic has struck with AMD, SpaceX, Google and Broadcom.
Elon Musk revealed on SpaceX's latest earnings call that the company's Starmind AI project will run on NVIDIA's Vera Rubin GPU architecture, both on the ground and eventually in orbit. Musk argued the NVL72 VR system design outperforms traditional rack-based computing setups and would be cheaper and more effective for SpaceX's needs.
At Hot Chips 2026, SK hynix's Jaesik Lee said hybrid bonding won't be ready in time for HBM4E and will instead debut with HBM5, as current HBM4 packages are already constrained by a 775-micron thickness ceiling matching standard logic wafers. To keep scaling within that limit, 16-Hi HBM4 stacks now use dies thinned to about 50 microns with half the interlayer gap of 12-Hi designs, while SK hynix continues using its existing MR-MUF bonding method through upcoming Nvidia Rubin-generation products.