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1.
Intel displays tech to build extreme multi-chiplet packages 12 times the size of the largest AI processors, beating TSMC's biggest — floorplan the size of a cellphone, armed with HBM5, 14A compute tiles and 18A SRAM
(tomshardware.com)
2025-12-26 | by Anton Shilov |
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| tags:
base
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base dies
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compute
2.
HBM undergoes major architectural shakeup as TSMC and GUC detail HBM4, HBM4E and C-HBM4E — 3nm base dies to enable 2.5x performance boost with speeds of up to 12.8GT/s by 2027
(tomshardware.com)
2025-12-02 | by Anton Shilov |
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| tags:
bandwidth
,
base
,
base dies
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