Dual interfacial H-bonding-enhanced deep-blue hybrid copper–iodide LEDs
Solution-processed light-emitting diodes (LEDs) are emerging as a promising technology for advanced solid-state lighting (SSL) and display industries, owing to their energy-efficient, low-cost, and straightforward manufacturing processes1-3. In this realm, lead-halide based perovskites4, organic semiconductors5, and colloidal core–shell quantum dots (QDs)6 have gained recognition as promising candidates. They have been utilized as emitting layers via solution processing and achieved impressive p