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1.
Post-silicon era gets closer as industry giants crack the 2D transistor scaling bottleneck with breakthrough tech — imec, ASML, and TSMC fab complementary 2D-material transistors at 50nm pitch on a 300mm wafer (tomshardware.com)
2.
SK Hynix moves 375-layer NAND into mass production, replacing tungsten with molybdenum (techspot.com)
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