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1.
Future AI chips could be built on glass (technologyreview.com)
2.
Transferable enantioselectivity models from sparse data (feeds.nature.com)
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China moves into manufacturing disruptive new semiconductor glass substrates as processor packaging competition intensifies (tomshardware.com)
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Substrate's claims about revolutionary ASML-beating chipmaking technology scrutinized, analyst likens the venture to a fraud — report pokes holes in the startup's technology, messaging, and leaders (tomshardware.com)
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American startup Substrate promises 2nm-class chipmaking with particle accelerators, at a tenth of the cost of EUV — X-ray lithography system has potential to surpass ASML's EUV scanners (tomshardware.com)
6.
Parsing JSON in Forty Lines of Awk (news.ycombinator.com)
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