GoKawiilJoe Maring / Android Authority
TL;DR Samsung is reportedly thinking about ditching an advanced packaging process for the Exynos 2700 chipset.
This could potentially result in the processor running hotter, although Samsung is introducing other cooling measures.
The Exynos 2700 is expected to power some Galaxy S27 and S27 Plus models next year.
Some Galaxy S27 and S27 Plus models are expected to be powered by Samsung’s own Exynos 2700 processor. We’ve already heard the first rumors about this chipset, but a new story suggests that the chip could undergo a somewhat concerning change.
Sisa-Journal reports that the Exynos 2700 chip could ditch Fan-Out Wafer-Level Packaging (FOWLP). Samsung is apparently thinking about abandoning this advanced manufacturing process because it’s a costly process and could also affect yield rates.
Don’t want to miss the best from Android Authority? Set us as a favorite source in Google Discover to never miss our latest exclusive reports, expert analysis, and much more.
to never miss our latest exclusive reports, expert analysis, and much more. You can also set us as a preferred source in Google Search by clicking the button below.
This could be a concerning change as FOWLP reportedly delivers improved thermal performance. This packaging process was first used on the Exynos 2400, and Samsung claimed at the time that it enabled a “23% bump in heat-resistance when running on a single core and an 8% improvement for multi-core.”
“I heard that while applying WLP to flagship Exynos chips was effective in terms of performance and thermal management, it did not generate much profit because the packaging itself became very complex and the yield risk was high,” an industry source told the outlet. “If the volume were large, profitability could be covered to some extent, but currently, since it is only being applied to a portion of the MX business unit’s own models, the cost burden is bound to be heavy.”
... continue reading