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Leading-edge foundry roadmaps for TSMC, Intel and Samsung — outlining the path to 1.4nm nodes and beyond

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Why This Matters

The advancement of 2nm-class process technology by TSMC, Samsung, and Intel marks a significant milestone in semiconductor manufacturing, enabling faster, more efficient chips that will drive innovation across consumer electronics, data centers, and AI applications. These developments highlight the industry's focus on pushing technological boundaries while emphasizing the high barriers to entry and the strategic shifts among leading foundries.

Key Takeaways

All three leading-edge foundries — Intel Foundry, Samsung Foundry, and TSMC — have initiated mass production of chips using 2nm-class process technology. Samsung was the first one to start production using its SF2 node (though it could be argued that this is a rebadged SF3P) around mid-2025, Intel followed suit with its 18A node in November (albeit at development lines in Oregon, not production lines in Arizona), and TSMC initiated high-volume manufacturing using its N2 process at two volume fabs in Taiwan in December. We outline what's next for these three leading-edge foundries.

The current state of the market

The amount of capital, expertise, and experience required to develop leading-edge process technologies and build high-volume fabs supporting advanced nodes is so high that only three companies in the world are currently capable of producing them. Companies like Rapidus have yet to prove they are a viable leading-edge chipmaker. Meanwhile, all three leading foundries are transitioning from traditional node scaling to a more segmented, architecture- and product-driven approach, but are doing so with different priorities.

(Image credit: Tom's Hardware)

TSMC is focused on predictable scaling, combined with aggressive specialization, which is why its roadmap is split into high-performance computing-oriented technologies with backside power delivery network (BSPDN) and cost/density-optimized nodes without it.

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Samsung has a wide range of node variants, though it is currently more focused on yield improvement, rather than on scaling, which is why its roadmap appears more iterative than breakthrough-focused. This is perhaps why it is behind competitors with its BSPDN implementation.

Intel seems to be pursuing the most aggressive technological roadmap with a conjoined implementation of gate-all-around (GAA) RibbonFET transistors and PowerVia BSPDN, rapid iteration, and the aggressive pursuit of High-NA EUV lithography in 2027 – 2028, years before its rivals.

Intel Foundry: The most ambitious chipmaker

Being a new player in the foundry market and a large integrated design manufacturer (IDM), Intel is pursuing a multi-faceted strategy aimed at addressing the needs of its own products, as well as attempting to land customers that do not necessarily require leading-edge process technologies.

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