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Kuo: Apple’s iPhone camera roadmap includes a costly upgrade

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Why This Matters

Apple's upcoming iPhone 18 Pro will feature a more advanced, yet costlier, camera system with a variable aperture lens, reflecting ongoing innovation in mobile photography. The shift to a new ultra-wide camera module in 2028 indicates Apple's focus on improving camera performance and manufacturing efficiency. These developments highlight Apple's commitment to enhancing user experience despite rising component costs, which could influence future pricing strategies.

Key Takeaways

Analyst Ming-Chi Kuo is out with a new look at Apple’s upcoming iPhone camera plans, including an under-the-hood ultra-wide module change and a surprisingly steep cost increase. Here are the details.

iPhone 18 Pro’s variable aperture lens to get pricier

It has been widely reported that later this year, one of the biggest changes to the iPhone 18 Pro’s camera system will be the debut of a variable-aperture Main camera, in contrast to the current fixed-aperture design.

However, that might come at a steep cost. According to analyst Ming-Chi Kuo, the new variable aperture lens will carry a 50% higher average selling price than Apple’s current high-end 7P lens system.

He says that Apple will source 40-50% of these components from Sunny Optical, which has also been supplying the MacBook Neo’s compact camera module (CCM), with Largan remaining the company’s main supplier.

This alone shouldn’t mean that Apple will increase the price of the iPhone 18 Pro and iPhone 18 Pro Max, but the component cost increase couldn’t come at a worse time, as Apple is already dealing with rising memory costs that are putting pressure on its margins.

A new ultra-wide module for 2028 iPhones

Beyond the iPhone 18 Pro, Kuo also shared an interesting tidbit about the camera modules expected for 2028 iPhones.

According to the analyst, the “2028 iPhone’s ultra-wide CCM is expected to drop flip-chip in favor of an improved COB version.”

In other words, Apple is planning to move away from the current flip-chip packaging method, where the image sensor is mounted face-down and connected to the module substrate through tiny solder bumps, adopting an improved chip-on-board design for the ultra-wide camera module instead.

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