GoKawiilWhen we referred to TSMC just several years ago, we called it 'the world's largest foundry,' implying that Intel was still the world's largest producer of advanced logic chips. However, having spent nearly $240 billion on capacity expansion over the last 10 years, TSMC now has nine sites with dozens of 300-mm fabs, many of which can process orders of magnitude more wafers using EUV-based process technologies than Intel*, which makes TSMC the world's largest maker of advanced logic chips.
Being the world's largest maker of advanced AI processors requires TSMC to stay ahead of its rivals, Intel and Samsung Foundry, both in terms of process technologies and, perhaps, even more importantly, in terms of production capacity.
Therefore, TSMC has kicked off the most aggressive manufacturing expansion in its history as the company races to meet explosive demand for AI processors, logic chips made on leading-edge nodes, and advanced packaging.
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(Image credit: TSMC)
During TSMC's Tech Symposium 2026 manufacturing presentations, the company revealed that in 2025 – 2026, it effectively doubled its historical construction pace, building or converting nine fab phases annually, up from an average of four phases per year. The company is simultaneously building or ramping new fabs in Taiwan, the U.S., Japan, and Germany. In addition, it introduces new ways to improve the productivity of existing facilities.
Swipe to scroll horizontally TSMC's new or ramping production facilities Site Name Phase Capabilities Fab Location Status Fab 20 1, 2 A16, N2 Hsinchu, Taiwan Ramping Fab 21 2 N3 Phoenix, Arizona Equipping Fab 21 3, 4 A16, N2 Phoenix, Arizona In construction Fab 22 1 A16, N2 Kaohsiung, Taiwan Ramping Fab 22 2, 3 A16, N2 Kaohsiung, Taiwan Equipped, ramping in H2 2026 Fab 23 - JASM 2 Down to N3 Kumamoto, Japan In construction as of January 2025. Construction stalled. Fab 24 - ESMC 1 N12, N16, N22, N28 Dresden, Germany In construction as of August 2024 Fab 25 1 A14, A13, A12 Taichung, Taiwan In construction
N2 ramp: Six-figure amounts of wafers per-month by 2029
The central part of TSMC's expansion plan is its N2 process technology. At present, the company is ramping up production of chips using N2 at two sites: Fab 20 phase 1 and phase 2 in Hsinchu near TSMC's global R&D center, and Fab 22 phase 1 in Kaohsiung. Ramping a leading-edge node at three facilities simultaneously is highly uncommon for foundries. The company also plans to ramp up production at Fab 22 phase 2 shortly and Fab 22 phase 3 by the end of the year. Eventually, Fab 22 phase 4 will come online as well. As a result, TSMC aims to start mass production on its N2 process technology at five facilities in the first year, which is at an unprecedented scale.
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