GoKawiilImec's semiconductor process technology roadmap sets the general direction of industry development and showcases the challenges the sector is set to face over the next few decades. The roadmap gives us an idea of the timelines for the next major process nodes and transistor architectures the company will research and develop in cooperation with industry giants, such as TSMC, Intel, Nvidia, AMD, Samsung, and ASML, among many others.
Imec's latest production node roadmap shows that the international research and development organization envisions 3 angstrom-class (0.3nm) fabrication technologies by 2038, but expects contact poly pitch (CPP) to stop scaling at A10 in 2030. While things might not be looking great for Moore's Law for imec, to continue scaling the chipmaker will need to adopt new technologies, such as CFET transistors and likely Hyper-NA EUV Lithography systems.
GAA transistors have seven years left
As the production of semiconductors becomes substantially more complicated, chipmakers no longer introduce all-new process technologies every couple of years. Instead, they typically roll out a new node generation every three years, with annual incremental enhancements in between. TSMC ramped N3B production in 2023, then followed it up with N3E in 2024, and N3P in 2025. Intel planned to follow the same pattern with 20A in 2024 (which was canceled), 18A in 2025, and 18A-P in 2027.
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Next-generation process technologies will continue to emerge at similar cadences, according to imec's roadmap.
(Image credit: Imec)
Interuniversity Microelectronics Centre considers that we now live in the 2nm-class era (N2) with contact poly pitch (CPP) of around 48nm, as well as cell height of around 132nm and 6 metal tracks. The reality may be a bit different as Intel's 18A has a CPP of 50nm as well as a cell height of 160nm (high density) or 190nm (high performance), whereas TSMC's N3 can boast with a CPP of 45nm. N2 (or 18A, if you wish) will be followed by its performance and efficiency-enhanced version in the next couple of years, which is in line with how the industry has been operating in recent years.
"Of course, we are going to extend our logic roadmap to the next generation beyond N2," said Julien Ryckaert, vice president of R&D at imec. "As you know, in two nanometers we have already jumped into a new technology device paradigm in the nanosheet era, and that is going to bring us deep into the Angstrom node."
(Image credit: Imec)
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