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Tin perovskite transistors stabilized through volatile coordination

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Why This Matters

This research demonstrates a novel approach to stabilizing tin-based perovskite transistors using volatile coordination layers, which enhances their thermal and environmental stability. Such advancements are crucial for developing more durable, efficient, and environmentally friendly electronic devices, potentially transforming the landscape of flexible and sustainable electronics in the tech industry and for consumers.

Key Takeaways

Thin-film fabrication

CsI (99.9%) and PbCl 2 (99.99%) were purchased from Xi’an Polymer Light Technology Corp. SnI 2 (99.99%), CsAc (99.9%), KAc (99.0%), NaAc (99.995%) and Sn(Ac) 2 were purchased from Merck, and RbAc (99.8%) was purchased from Alfa Aesar. These powders were directly used as thermal-deposition sources. CsSnI 3 films were deposited following previously reported procedures and subjected to an initial annealing to complete film formation37. Subsequently, A-Ac (A = Cs+, K+, Rb+ or Na+) layers were deposited on the pre-annealed CsSnI 3 films, followed by a second annealing step at 100 °C for 10 min in an N 2 -filled glovebox. The thickness of each deposited source was measured with a quartz crystal microbalance.

TFT fabrication and characterization

The bottom-gate, bottom-contact TFTs were fabricated on highly doped Si substrates with a 100-nm thermally grown SiO 2 dielectric. The Ni/Au (3/30 nm) electrodes were thermally deposited with a shadow mask (width W = 200 µm and length L = 100 µm). The CsSnI 3 channel layer (W = 1,200 μm and L = 600 μm) was then deposited through the shadow mask, as previously reported, and annealed at 340 °C for 2 min. Finally, the KAc layer was deposited onto the perovskite surface and annealed at 100 °C for 10 min in an N 2 -filled glovebox. All TFTs were characterized using a Keithley 4200SCS at room temperature. Device stability was evaluated by periodically measuring the electrical characteristics after storage under specific conditions. To assess their thermal stability, the TFTs were stored on a hotplate at 100 °C in an N 2 -filled glovebox. Air stability was tested by storing the TFTs in the dark at room temperature and a relative humidity of 20–40%.

The values of saturation mobility (μ sat ) and V TH were extracted by linearly fitting I DS 1/2 versus V GS at the saturation regime, and linear mobility (μ lin ) was extracted at the linear regime from the I DS versus V GS curve following equation (1):

$${\mu }_{\mathrm{sat}}=\frac{2L}{{{WC}}_{{\rm{i}}}}\frac{|{I}_{\mathrm{DS}}|}{{{(V}_{\mathrm{GS}}-{V}_{\mathrm{TH}})}^{2}},\,\,\,\,\,{\mu }_{\mathrm{lin}}=\frac{L}{{{WC}}_{{\rm{i}}}{V}_{\mathrm{DS}}}\frac{{\partial I}_{\mathrm{DS}}}{{\partial V}_{\mathrm{GS}}},$$ (1)

where L, W and C i are the channel length and width and the insulating dielectric areal capacitance, respectively. The subthreshold swing is the inverse of the maximum slope of the I DS versus V GS plot.

Film characterization

The crystal structural properties of the films were investigated using XRD with a SmartLab 9 kW (Rigaku). The thermogravimetric analysis was conducted using a SDT Q-600 (TA Instruments). The samples for transmission electron microscopy were prepared by vapour deposition on a carbon grid and subsequently measured using a JEOL JEM-2200FS (with Image Cs-corrector). The XPS characterization was performed with a Nexsa and an Ulvac PHI Genesis. The surface morphology was examined using high-resolution field emisson-scanning electron microscopy (FE-SEM) (JSM 7800F Prime) with a 5-keV electron beam. The atomic force microscopy images were collected using an NX-10 (Park Systems). The time-of-flight secondary-ion mass spectrometry measurements were performed on an IONTOF M6 instrument in dual-beam mode using a Bi-based analysis beam with O 2 + sputtering for positive-ion depth profiling and two-dimensional mapping and a Bi3+ analysis beam with Ar1050+ sputtering for negative-ion depth profiling and two-dimensional mapping. The depth was calibrated from the sputter crater depth measured by a surface profiler. The Kelvin probe force microscopy measurements were performed using a Jupiter XR (Oxford Instruments). Fourier-transform infrared spectroscopy was performed using a Vertex 70v (Bruker) in transmittance mode. The Hall measurements of the films were carried out using the van der Pauw method with a 0.51-T magnet (HMS-3000, Ecopia). Ultraviolet–visible absorption spectroscopy was performed with a JASCO V-770 spectrophotometer. Time-resolved photoluminescence signals generated by 2.41 eV fs pulses from an OPO coupled Ti:sapphire laser were analysed with a time-correlated single photon counting (TCSPC) device (PicoQuant, PicoHarp 300). Start and stop signals for the device were obtained with a photodiode (PicoQuant, TDA200) and a single-photon avalanche diode (Micro Photon Devices, PD-100-CTC), respectively. The temporal resolution, defined as the full-width at half-maximum of the instrumental response function, was 50 ps at 2.41 eV. A 750-nm long-pass filter was placed in front of the single-photon avalanche diode to block the incident laser beam. The average power was maintained below 200 nW to prevent unwanted photo-induced degradation. The laser source for steady-state photoluminescence (SSPL) was the same as time-resolved optical measurement. The excitation beam was focused onto a spot approximately 1 μm in diameter using an objective lens (×40 and numerical aperture 0.60). Backscattered photoluminescence signals collected by the same objective lens were directed into a Czerny–Turner spectrometer (Andor, Shamrock 303i) equipped with a CCD camera (Andor, Newton).

First-principles calculations

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