This work was carried out in part through the use of MIT.nano’s facilities. X.Z., S.Z., S.P., J.Î-j.W., W.D.O. and J.K. acknowledge the support by the US Army Research Office grant number W911NF2210023. S.Z., S.P., J.Î-j.W. and W.D.O. acknowledge the support from the National Science Foundation for grant number 2412810. S.Z. acknowledges support from the Faculty for the Future Fellowship from the Schlumberger Foundation. K.Z., T.H.Y. and J.K. acknowledge the support by the National Science Foundation under award number 2527588. C.A.O., L.G.P.M. and R.C. acknowledge the support by the US Department of Energy, Office of Science National Quantum Information Science Research Center’s Co-design Center for Quantum Advantage (C2QA) under contract number DE-SC0012704. C2QA participated in this research. Y.Z. and J.K. acknowledge the support by the Air Force Office of Scientific Research under award number FA2386-24-1-4049. Z.W. and J.K. acknowledge the support by the Semiconductor Research Corporation Center 7 in JUMP 2.0 (award number 145105-21913). T.Z. and J.K. acknowledge the support by the US Department of Energy (DOE), Office of Science, Basic Energy Sciences (BES) under award DE-SC0020042. Z.H. and J.K. acknowledge the support from the US Army DEVCOM ARL Army Research Office through the MIT Institute for Soldier Nanotechnologies under Cooperative Agreement number W911NF-23-2-0121. X.L. and Y.H. acknowledge support from NSF (FUSE-2329111 and CMMI-2239545) and Welch Foundation (C-2065). X.L. and Y.H. acknowledge the Electron Microscopy Center, Rice University. X.L. acknowledges support from the Rice Advanced Materials Institute (RAMI) at Rice University as a RAMI Postdoctoral Fellow. Part of the cross-sectional TEM studies were performed using the facilities in the UConn/Thermo Fisher Scientific Center for Advanced Microscopy and Materials Analysis (CAMMA). S.L. and P.K. acknowledge support from DMR-2105048 (NSF). S.P. acknowledges the support by the National Research Foundation of Korea (grant number RS-2025-02317602). S.V., K.T. and S.M. acknowledge the support by the Department of the Air Force under Air Force Contract No. FA8702-15-D-0001 and FA8702-25-D-B002. The views and conclusions contained herein are those of the authors and should not be interpreted as necessarily representing the official policies or endorsements of the US Government, the National Science Foundation, or the Department of the Air Force.
Encapsulation epitaxy of air-stable 2D superconductors for quantum circuits
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