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First look: Xiaomi 18 Fold makes its official debut at IFA 2026 with XRing O3 chip

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Why This Matters

The Xiaomi 18 Fold's debut at IFA 2026 marks a significant milestone for the company's push into flagship foldable smartphones, especially with its own XRing O3 chip. This development highlights Xiaomi's growing influence in the foldable market and its advancements in mobile processing technology, offering consumers a potentially more powerful and innovative device. The launch also underscores the increasing competition among tech giants in the foldable segment, shaping the future of mobile devices.

Key Takeaways

Adamya Sharma / Android Authority

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TL;DR Xiaomi is officially showing off the Xiaomi 18 Fold at IFA 2026.

It’s Xiaomi’s first flagship smartphone powered by its own XRing O3 chip.

The wide-screen foldable had previously leaked in real-world images, revealing a triple-camera setup and cherry red finish.

Xiaomi is also using its IFA debut to showcase more than 380 products, including its “Human x Car x Home” ecosystem and the European expansion of its Mijia smart home brand

Xiaomi has officially shown off the Xiaomi 18 Fold at IFA 2026. The company gave us our first real-world look at the upcoming wide-screen foldable after weeks of leaks. The phone is being showcased at Xiaomi’s huge IFA booth alongside more than 380 products spanning smartphones, smart home devices, cars, AI, and other tech.

This is the first time Xiaomi has shown off a real Xiaomi 18 Fold, revealing a cherry red color. This follows weeks of leaks and the publication of official renders yesterday. A close look at the wide foldable reveals that it has a triple-camera setup. The text on the camera bar (see first image below) also suggests we’re looking at a focal range from 17mm to 80mm. So it’s possible that the new foldable has a ~3.3x telephoto camera.

Xiaomi 18 Fold: Hot or not? 405 votes Hot! 84 % Not! 16 %

The Xiaomi 18 Fold is particularly notable for its chipset. Xiaomi says the foldable is the first flagship smartphone powered by its next-generation XRing O3 chip, marking another step in the company’s push to develop its own processors. The company has also confirmed that the device will feature ChangXin Memory Technologies’ next-generation LPDDR6 RAM, which can reach speeds of up to 12,800Mbps.

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