SK Hynix in talks to make memory chips at Intel's Ohio site
SK Hynix is reportedly discussing options with Intel to produce memory chips in the US for the first time, possibly by leasing space at Intel's delayed Ohio fab or forming a joint venture involving cloud companies. SK Hynix has confirmed it is exploring new production sites but says no decisions have been made, and Intel declined to confirm details beyond ongoing investment in the Ohio project.
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A deal would mark SK Hynix's first US wafer fabrication, going beyond its existing Indiana packaging plant that relies on Korean-made wafers, and could help ease AI-driven memory supply constraints. It would also give Intel a much-needed partner to help revive its stalled Ohio megafab, which has faced years of delays.
- SK Hynix is in early talks to lease or co-develop part of Intel's Ohio fab for memory chip production.
- This would be SK Hynix's first US-based wafer fabrication, distinct from its Indiana packaging plant.
- Intel could benefit from a partner to help offset delays and costs at its long-stalled Ohio site.
Source: techspot.com — Rob Thubron, 2026-09-16
Published there as: “SK Hynix eyes Intel's Ohio fabs for US memory production”
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