GoKawiilHelion wins $175M federal award to build US semiconductor line for fusion plants
Fusion startup Helion announced it received $175 million in Department of Commerce CHIPS Act funding to research, develop and manufacture advanced semiconductors and power electronics for its fusion power plants. The company also disclosed a separate $50 million private investment. The funds will build an automated semiconductor production line in Washington State to supply Helion's Orion power plant, currently under construction.
GoKawiil's interpretation of the reporting above, not reported fact.
CEO David Kirtley says current power electronics lose 5-10% of electricity, and halving that loss could double the output of Helion's fusion system, suggesting the semiconductor work is central to the plant's viability. Kirtley also claims no U.S. manufacturer currently produces this class of high-voltage, pulsed semiconductor, which could position Helion to supply a device used beyond fusion in manufacturing, medicine and defense. The investment also ties into Helion's 2028 commitment to deliver grid electricity to Microsoft.
- Helion received $175 million in CHIPS Act funding plus a $50 million private investment.
- The money funds a new semiconductor manufacturing line in Washington State to serve its Orion fusion plant.
- Helion says the technology could cut energy losses and double fusion plant output, while also serving other industries.
Source: techcrunch.com — Tim De Chant, 2026-10-22
Published there as: “Fusion startup Helion is developing new semiconductors that could double output of its power plants”
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