Nvidia signs multi-year deals with Ibiden, Amkor, SPIL and others to lock up chip capacity
At GTC Berlin on October 21, Nvidia announced a series of multi-billion-dollar agreements with substrate, packaging, testing and optics suppliers including Ibiden, Unimicron, Samsung Electro-Mechanics, SPIL and Amkor. The deals run through 2028 and target steep capacity increases, such as 2.5x dedicated substrate capacity within three years, a 15x expansion in optical engine output by mid-2027, and a 300% rise in interposer wafer capacity by end-2028.
GoKawiil's interpretation of the reporting above, not reported fact.
By prepaying for and reserving manufacturing capacity years in advance, Nvidia appears to be trying to lock in supply ahead of rivals as AI chip demand outstrips what the supply chain can currently produce, according to CEO Jensen Huang's comments on capacity being the binding constraint. This kind of long-term commitment could also make it harder for smaller AI chipmakers to secure the same specialized packaging and testing resources, potentially reinforcing Nvidia's market position over the next several years.
- Nvidia signed multi-year, multi-billion-dollar deals covering substrates, packaging, testing and optics suppliers worldwide.
- Targets include 2.5x substrate capacity, 15x optical engine capacity, and 300% more interposer wafer capacity by 2028.
- CEO Jensen Huang says capacity, not demand, is now the main bottleneck for AI infrastructure buildout.
Source: tomshardware.com — Etiido Uko, 2026-10-27
Published there as: “Nvidia is bankrolling AI accelerator supply chain buildout to reserve production capacity”
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