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1.
TSMC's details next-gen CoWoS roadmap: over 14-reticle packages and 48x leap in compute power expected by 2029 — massive size enables 24 HBM5E stacks and additional memory bandwidth jump (tomshardware.com)
2.
SpaceX says it is going to begin manufacturing GPUs — $1.75 trillion IPO listing reportedly includes in-house GPU production (tomshardware.com)
3.
Meta commits to 1 gigawatt of custom chips with Broadcom as Hock Tan decides to leave board (cnbc.com)
4.
Meta commits to 1 gigawatt of custom chips with Broadcom as Hock Tan agrees to leave board (cnbc.com)
5.
Meta commits to one gigawatt of custom chips with Broadcom as Hock Tan agrees to leave board (cnbc.com)
6.
Intel's EMIB-T packaging technology set for fab rollout this year — as TSMC CoWoS capacity remains limited,EMIB-T is preparing for advanced AI accelerator designs (tomshardware.com)
7.
Intel and SambaNova team up on heterogenous AI inference platform — different hardware performs different workloads (tomshardware.com)
8.
Memory will consume 30% of hyperscaler AI data center spending this year, a 4X increase over 2023 — Nvidia gets preferential supply terms well below standard market rates, says analyst firm (tomshardware.com)
9.
Why Nvidia just poured $2 billion into AI ASIC competitor Marvell — NVLink Fusion turns into soft ecosystem lock-in (tomshardware.com)
10.
How Nvidia's $20 billion Groq 3 LPU deal reshapes the Nvidia Vera Rubin Platform — Samsung 4nm process serves as bedrock for SRAM-based AI accelerator chip (tomshardware.com)
11.
US gov't revokes controversial AI hardware export rule that would mandate investments from foreign companies — new export rules are still in the works, though (tomshardware.com)
12.
Microsoft built a 750W AI chip to challenge Nvidia's dominance, claims 3x performance gains over Amazon (techspot.com)
Today's top topics: openai
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