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1.
YMTC's third Wuhan fab clears Beijing's 50% local tooling threshold as two more are planned — move positions company toward 3D NAND production to capitalize on wafer bonding strengths
(tomshardware.com)
2026-04-15 | by Luke James |
get 3D NAND Flash Memory Kit →
| tags:
ymtc
,
wuhan fab
,
3d nand
2.
AMD hit with lawsuit over hybrid bonding tech behind potent 3D V-Cache — Adeia claims company's gaming chip infringes 10 of its patents
(tomshardware.com)
2025-11-03 | by Luke James |
get V-Cache →
| tags:
adeia
,
bonding
,
claims
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