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1.

YMTC's third Wuhan fab clears Beijing's 50% local tooling threshold as two more are planned — move positions company toward 3D NAND production to capitalize on wafer bonding strengths (tomshardware.com)

2026-04-15 | by Luke James | get 3D NAND Flash Memory Kit → | tags: ymtc, wuhan fab, 3d nand

2.

AMD hit with lawsuit over hybrid bonding tech behind potent 3D V-Cache — Adeia claims company's gaming chip infringes 10 of its patents (tomshardware.com)

2025-11-03 | by Luke James | get V-Cache → | tags: adeia, bonding, claims

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