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1.
LG enters chip packaging arena with Laser Direct Imaging machine, as TSMC's CoWoS remains constrained — maskless machine is designed to pattern fine interconnects, trading resolution for higher throughput (tomshardware.com)
2026-08-21 | by Anton Shilov | tags: lg electronics, tsmc, coos
2.
AMD's Instinct MI455X: Aiming for the Sun (news.ycombinator.com)
2026-07-24 | by George Cozma | tags: amd, instinct mi455x, cdna5 architecture
3.
Memory has grown to nearly two-thirds of AI chip component costs (news.ycombinator.com)
2026-05-24 | by Venkat Somala | get AI Chip Memory Module → | tags: nvidia, amd, hbm
4.
One of the World’s Tallest, Oldest Trees Is Ablaze in Oregon (gizmodo.com)
2025-10-31 | by Ellyn Lapointe | get Emotional Intelligence book → | tags: august, coos, doerner
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