GoKawiilQualcomm to license Huawei's LogicFolding chip-stacking patents, Bloomberg reports
Qualcomm has agreed to a multiyear cross-license deal with Huawei covering patents tied to LogicFolding, the chip-stacking method used in Huawei's Kirin 9050 Pro, according to Bloomberg. The agreement reportedly spans 5G devices, AI services, optics and networking, and Qualcomm also plans to buy specific Huawei U.S. patents in compute, AI and networking technology. Neither company's public statements named LogicFolding or any specific chip, and the deal still requires approval.
GoKawiil's interpretation of the reporting above, not reported fact.
Bloomberg frames the arrangement as validation of Huawei's chip engineering despite U.S. export restrictions that block access to advanced lithography tools, since LogicFolding reportedly offers a workaround by stacking dies for faster data transmission. This would mark the first time Qualcomm pays to license Huawei's patents, which could signal a shift in the competitive balance between the two companies on semiconductor intellectual property. The deal may also ease broader patent tensions between the firms, though the commercial and strategic implications depend on regulatory approval and details neither company has disclosed.
- Qualcomm plans to license Huawei patents behind the LogicFolding die-stacking technique, per Bloomberg.
- The cross-license deal reportedly covers 5G, AI, optics and networking, with Qualcomm also buying specific Huawei U.S. patents.
- LogicFolding, used in the Kirin 9050 Pro, is described as a workaround for China's lack of EUV lithography access.
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Published there as: “Qualcomm will license patents behind Huawei’s LogicFolding chip architecture, report says”
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