GoKawiilQualcomm to license Huawei's LogicFolding chip-stacking patents, Bloomberg reports
Qualcomm has agreed to a multiyear cross-license deal with Huawei covering patents tied to LogicFolding, the chip-stacking method used in Huawei's Kirin 9050 Pro, according to Bloomberg. The agreement reportedly spans 5G devices, AI services, optics and networking, and Qualcomm also plans to buy specific Huawei U.S. patents in compute, AI and networking technology. Neither company's public statements named LogicFolding or any specific chip, and the deal still requires approval.