Intel begins tool installation at Arizona's Fab 62, targets 2028 output
Intel said it has started installing production equipment at its Fab 62 facility in Arizona, with mass production targeted for late 2028. The company also gave updates on its Ohio One complex and confirmed it has brought High-NA EUV lithography into high-volume manufacturing, while continuing to invest in U.S.-based process R&D, advanced packaging and photomask production.
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Intel has not assigned a specific process node to Fab 62, despite earlier plans tying the site to its most advanced technologies like 20A and 18A, suggesting its manufacturing roadmap remains in flux. The emphasis on domestic R&D and High-NA EUV adoption signals Intel's effort to position itself competitively in leading-edge chipmaking against rivals like TSMC and Samsung.
- Fab 62 in Arizona has begun installing production tools, aiming for 2028 mass production.
- Intel has not disclosed which chip node Fab 62 will produce, despite earlier ties to 18A/20A plans.
- Intel confirmed High-NA EUV lithography is now integrated into high-volume manufacturing.
Source: tomshardware.com — Anton Shilov, 2026-10-21
Published there as: “Intel installs production tools at Fab 62 in Arizona, provides updates on Ohio chip fab”
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