GoKawiil
Tech News
Intel said it has started installing production equipment at its Fab 62 facility in Arizona, with mass production targeted for late 2028. The company also gave updates on its Ohio One complex and confirmed it has brought High-NA EUV lithography into high-volume manufacturing, while continuing to invest in U.S.-based process R&D, advanced packaging and photomask production.
A report from McKinsey and the SEMI Foundation, cited by CNBC, projects that US semiconductor fabs could face up to 157,000 unfilled jobs by 2030. Only 3% of American engineering graduates currently enter the chip industry, and 73% of chip companies say they struggle to fill engineering positions, even as firms like TSMC, Intel, Samsung, Micron, and SK hynix expand US manufacturing capacity.
SK hynix is reportedly discussing options with Intel for U.S.-based chip production, including leasing space at Intel's under-construction Ohio One facility or forming a joint venture involving Intel and AI hyperscalers seeking HBM supply. The talks come as SK hynix expands its Indiana HBM packaging plant following its $26.5 billion Nasdaq listing, though neither company has confirmed the discussions.