GoKawiilDiamond Foundry unveils 200mm single-crystal diamond wafer
Diamond Foundry, a lab-grown diamond company, announced it has produced the world's first 200mm single-crystal diamond wafer, a size comparable to those used in older-generation semiconductor fabs. Unlike polycrystalline diamond, single-crystal diamond retains high thermal conductivity while remaining electrically insulating, though the current sample is unpolished and requires further processing before use by chipmakers. The company also presented projections suggesting a 300mm version could be achievable before 2030.
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Diamond's thermal conductivity, said to be several times greater than copper's, could help address escalating heat problems in AI chips as their power demands grow. If single-crystal diamond wafers can be scaled to sizes used in leading-edge chip manufacturing, they could become a practical cooling material for semiconductors, though the unpolished state of the current wafer suggests commercial readiness is still some way off.
- Diamond Foundry created the first 200mm single-crystal diamond wafer, a size used in older semiconductor fabs.
- Single-crystal diamond combines high thermal conductivity with electrical insulation, potentially easing AI chip heat issues.
- The company projects a 300mm wafer could be possible before 2030, though the current sample remains unpolished.
Source: tomshardware.com — Jowi Morales, 2026-11-08
Published there as: “Diamond Foundry creates world's first 200mm single-crystal diamond wafer”
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