Musk's Terafab tells suppliers it wants 1M wafers/month by 2032
Elon Musk's Terafab, a Tesla-SpaceX joint venture, has reportedly informed chip equipment makers it aims to produce 1 million wafers per month after 2032, with about 700,000 allocated to memory and over 300,000 to logic chips, according to Financial News. Terafab's procurement team has visited Japan asking some suppliers for delivery within months, and is targeting volume production in the second half of 2028.
GoKawiil's interpretation of the reporting above, not reported fact.
The planned memory output would rival or exceed Samsung's and SK hynix's current DRAM capacities, suggesting Terafab could become a major new competitor in memory manufacturing if realized. The three-year-or-less timeline to volume production is unusually aggressive for leading-edge fabs, which may explain why industry observers were initially skeptical, though supplier engagement reported at SEMICON West and in Japan indicates growing belief the plans could materialize.
- Terafab aims for 1 million wafers/month after 2032, with 700,000 for memory and 300,000+ for logic.
- The memory target alone could match or exceed Samsung's and SK hynix's current DRAM capacities.
- Terafab is reportedly working with Intel on 2nm and 1.4nm logic processes and has engaged Japanese and Korean suppliers.
Source: tomshardware.com — Shane Downing, 2026-11-10
Published there as: “Elon Musk’s Terafab targets 1 million wafers a month after 2032”
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