GoKawiilGlass-core chip substrates still stuck at qualification stage as Absolics, Samsung slip timelines
SKC's Absolics unit told investors on July 27 that embedded glass substrate samples from its Covington, Georgia plant are undergoing package-level reliability testing in Taiwan, with results expected by year-end. Meanwhile Samsung Electro-Mechanics and Sumitomo Chemical's Dongwoo Fine-Chem finalized a $310 million joint venture on July 2 aiming for production in late 2027, while Intel, the technology's original champion, has pushed back its own rollout to around 2030 and shifted toward licensing patents instead.