Chip Packaging - GoKawiil

Intel patent embeds MicroLEDs into glass chip packaging via TGVs

Intel has been granted a U.S. patent describing a method to embed MicroLED-equipped dies inside glass chip substrates, connected via Through-Glass-Vias for power and signaling. The design uses laser etching, copper electroplating, and silicon nitride bonding layers to integrate RGB-emitting dies into packaging, according to TrendForce. Intel's filing cites diagnostic testing and customizable surface lighting as potential applications.

tomshardware.com · 2026-09-29

Glass-core chip substrates still stuck at qualification stage as Absolics, Samsung slip timelines

SKC's Absolics unit told investors on July 27 that embedded glass substrate samples from its Covington, Georgia plant are undergoing package-level reliability testing in Taiwan, with results expected by year-end. Meanwhile Samsung Electro-Mechanics and Sumitomo Chemical's Dongwoo Fine-Chem finalized a $310 million joint venture on July 2 aiming for production in late 2027, while Intel, the technology's original champion, has pushed back its own rollout to around 2030 and shifted toward licensing patents instead.

tomshardware.com · 2026-08-27