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High Na Euv Lithography

2 GoKawiil briefs on this topic

Tom's Hardware Premium roundup covers Apple OLED touch plans and Micron's chip roadmap

Tom's Hardware's November 7 Premium roundup features an interview-driven look at why Apple is reportedly adding touch to OLED (PROLED) displays in 2026, a detailed breakdown of Micron's new DRAM and NAND roadmap including 1-delta DRAM made in the US and 400-plus-layer 11th-gen NAND, and a conversation with GlobalFoundries VP Sudipto Bose about its new FDX Fusion process, which uses DUV lithography to achieve 7nm-class performance.

ASML plans 12-inch mask for High-NA EUV, aiming for 2033 rollout

ASML is developing a larger 12-inch mask format for its next-generation High-NA EUV lithography systems, letting them print chips as large as those made with current EUV tools. The company expects a pilot line by 2031 and high-volume production by 2033, with CTO Marco Pieters saying the shift could boost system productivity by 40% if the industry adopts it together.