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Canada has agreed to join the European Union's EuroHPC Joint Undertaking, a consortium that pools supercomputing resources across member states. The arrangement would give Canadian researchers access to shared high-performance computing infrastructure alongside European partners.
A commentary piece contends that the mental traits driving business success—pushing through discomfort, sustaining focus under pressure, and executing despite obstacles—do not automatically transfer to managing personal health and fitness. The author argues that caring for one's body requires a distinct mindset separate from the drive that makes someone excel professionally.
Qualcomm's new Snapdragon 8 Elite Gen 6 lacks High Performance Memory, certain video codecs, and Matrix cores for AI graphics that were present on last year's Snapdragon 8 Elite Gen 5. These capabilities are instead reserved for the pricier Snapdragon 8 Elite Extreme Gen 6, which also gets 50% more local memory for on-device AI models than the standard Gen 6.
A newly released white paper examines how single-phase direct liquid cooling addresses escalating thermal loads in AI and high-performance computing systems, where individual chips now exceed 1,000 watts and racks can dissipate over 100 kilowatts. It compares this approach against two-phase and immersion cooling methods, and outlines how liquid cooling works at both chip and system levels.
IEEE Computer Society and ACM have selected Jie Ren of King Abdullah University of Science and Technology, Amit Samanta of University of Utah, and Xuan Wu of Oregon State University as the 2026 George Michael Memorial HPC Fellowship recipients. The fellowship recognizes outstanding doctoral students working in high-performance computing.