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Hock Tan

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Intel, Broadcom CEOs flag capital costs as next AI bottleneck

At the DBS Asia Future Forward Conference in Singapore, Broadcom CEO Hock Tan said access to capital could become a bigger constraint on AI growth than shortages of chips, memory or electricity. Intel CEO Lip-Bu Tan agreed, citing rising capital costs and unresolved questions about whether heavy AI investments will generate adequate returns. Hock Tan added that prior supply bottlenecks, such as memory shortages, have historically eased over time, with wafer shortages potentially easing by 2028-2029.