GoKawiilIntel patent embeds MicroLEDs into glass chip packaging via TGVs
Intel has been granted a U.S. patent describing a method to embed MicroLED-equipped dies inside glass chip substrates, connected via Through-Glass-Vias for power and signaling. The design uses laser etching, copper electroplating, and silicon nitride bonding layers to integrate RGB-emitting dies into packaging, according to TrendForce. Intel's filing cites diagnostic testing and customizable surface lighting as potential applications.