Samsung and SK Hynix plan NAND upgrades at Chinese plants for AI memory chips
Samsung Electronics is reportedly planning to convert its Xian factory to produce 286-layer NAND flash chips by year-end, while SK Hynix aims to upgrade its Dalian plant to make chips with 240 or more layers, according to Reuters sources. Both companies are racing to boost advanced memory output as AI data center demand grows, while fending off rising competition from Chinese manufacturers such as CXMT and YMTC.