GoKawiilTower Semiconductor, Japan government to invest $4B in optical chip fabs
Tower Semiconductor plans to co-invest $4 billion with the Japanese government to expand its Niigata and Toyama fabs into a major hub for optical-connectivity chips. The plan, dubbed Track One and Track Two, will convert an idle 200mm fab to 300mm production, boost output at an existing 300mm fab, and eventually add a new 300mm fab, raising total capacity to the equivalent of 45,000 300mm wafers per month by 2029.