GoKawiilTSMC reportedly considers 20% price hike on CoWoS advanced packaging
TrendForce, citing supply chain sources, reports that TSMC is considering raising prices for its CoWoS advanced packaging technology by up to 20%. The move reflects tight capacity for packaging AI chips, driven by demand for Nvidia's Blackwell and upcoming Rubin GPUs, along with longer equipment lead times. TSMC has not confirmed the report.