Thermal Management

Apple runs graphite heat pipe through iPhone Duo's hinge for A20 Pro cooling

Apple's upcoming foldable iPhone Duo and the iPhone 18 Pro line will both use the new A20 Pro chip, built with an 'M-class-inspired' packaging design borrowed from Mac processors. To manage heat in the foldable's tight, hinge-divided chassis, Apple engineered a graphite thermal pathway that runs through the hinge itself to spread heat away from the chip. Apple silicon engineering VP Dan Murray and thermal design manager Banafsheh Barabadi described the design choices to accommodate one chip across two very different phone shapes.

pcmag.com · 2026-10-13

Guide highlights processor, RAM and cooling as key specs for Android gaming phones

A new buying guide breaks down the essential hardware to check before purchasing an Android phone for gaming, starting with the chipset that houses the CPU and GPU. It also flags RAM capacity and thermal management systems like vapor chambers as critical factors that determine sustained performance during long gaming sessions.

engadget.com · 2026-09-20