Through Glass Vias

Intel patent describes embedding MicroLEDs inside CPU packages

Intel has published a patent, filed in 2022, for integrating MicroLEDs directly into a CPU package using a glass substrate with through-glass vias connected to the die for power and signal routing. The filing describes multi-colored LEDs that could light up wording on the processor, either as an aesthetic feature or to indicate specific operations the chip is performing.

tomshardware.com · 2026-09-29

Intel patent embeds MicroLEDs into glass chip packaging via TGVs

Intel has been granted a U.S. patent describing a method to embed MicroLED-equipped dies inside glass chip substrates, connected via Through-Glass-Vias for power and signaling. The design uses laser etching, copper electroplating, and silicon nitride bonding layers to integrate RGB-emitting dies into packaging, according to TrendForce. Intel's filing cites diagnostic testing and customizable surface lighting as potential applications.

tomshardware.com · 2026-09-29