GoKawiilSK Hynix breaks ground on $4 billion HBM packaging plant in Indiana
SK Hynix held a groundbreaking ceremony at Purdue University in West Lafayette, Indiana, for its first U.S. facility, a $4 billion plant dedicated to packaging high-bandwidth memory chips. CEO Kwak Noh-Jung said the site will become a key American production base for HBM by 2030, with its first cleanroom expected to open in October 2028, though actual chip manufacturing will still occur in South Korea and China.