GoKawiil
Tech News
Xiaomi introduced the Xring O3, a 3-nanometer system-on-chip built for its premium smartphones, marking its deepest push yet into flagship silicon design. The chip's 10-core CPU and new G2-Ultra NX GPU pushed its AnTuTu benchmark past 5 million for the first time among flagship processors, while a redesigned NPU delivers 200 TOPS for on-device AI tasks tied to Xiaomi's MiMo platform.
New leaked photos shared on Weibo by tipster Digital Chat Station show what appears to be Xiaomi's upcoming book-style foldable, featuring a wide inner display, noticeable bezels, and a punch-hole front camera. The design closely matches Xiaomi's own HyperOS 4 teaser image, lending credibility to the leak ahead of the device's confirmed September debut as the Xiaomi 18 Fold.
Xiaomi's new Xring O3 processor scored 3,945 in Geekbench single-core and 15,221 in multi-core tests, putting it roughly on par with Apple's silicon on single-threaded work but far ahead on multithreaded tasks. The chip packs 44MB of cache, more than most laptop CPUs, and its top C1-Ultra cores feature 21 execution ports with SME2 and SVE2 support for AI and SIMD workloads.
Xiaomi has detailed its new XRing 03 processor on Weibo, built on a 3nm process and featuring an unannounced Arm G2-Ultra NX GPU with 16 cores and AI-based upscaling. The chip also includes a 10-core CPU with six 'super' and four 'large' cores, no small cores, peaking at 4.35GHz, plus a four-core NPU rated at 200 TOPS. It will debut in the Xiaomi 18 Fold, set to launch next month.
Xiaomi announced price hikes of up to ¥20,000 (about $137) on several Xiaomi, Redmi, and POCO devices in Japan, citing surging memory and component costs. The Xiaomi 17T Pro and multiple POCO X8 Pro and X8 Pro Max configurations see the steepest jumps, some rising nearly 25%, while tablets face smaller increases of ¥2,000 to ¥10,000. The new prices take effect September 1 for Xiaomi and Redmi products and September 4 for POCO models.