GoKawiil - Tech News

61.

Intel is in talks with Google and Amazon to power AI chips with new packaging tech (techspot.com)

2026-04-08 | get Intel AI Chip Packaging Kit → | tags: intel, google, amazon

62.

Intel reportedly in talks with Google and Amazon over advanced packaging — major customers could take advantage of EMIB-T later this year (tomshardware.com)

2026-04-07 | by Luke James | get Intel EMIB-T Packaging Kit → | tags: intel, google, amazon

63.

Intel is going all-in on advanced chip packaging (arstechnica.com)

2026-04-07 | get Intel Chip Packaging Kit → | tags: intel, chip packaging, fab 9

64.

Why TSMC grew four times faster than its foundry rivals in 2025 — price hikes, vertical integration, and commanding technology lead pay dividends (tomshardware.com)

2026-04-06 | by Luke James | get TSMC 2025 Tech Notebook → | tags: tsmc, 7nm, 3nm

65.

The Ridiculously Nerdy Intel Bet That Could Rake in Billions (wired.com)

2026-04-06 | by Lauren Goode | get Intel Core i9 Processor → | tags: intel, fab 9, advanced chip packaging

66.

TSMC reportedly plans to build 12 fabs, four packaging facilities in Arizona — plan purportedly part of Taiwan's agreed $500 million investment in the US (tomshardware.com)

2026-04-03 | by Anton Shilov | get TSMC Chip Manufacturing Kit → | tags: tsmc, arizona, fabs

67.

$1,299 Asus OLED gaming monitors are arriving with cracked panels for many buyers — cut-down packaging with no protection for the panel gets the blame (tomshardware.com)

2026-04-03 | by Zhiye Liu | get Asus ROG Swift OLED Monitor → | tags: asus, rog swift oled, pg32ucdm

68.

What the New Starbucks ‘Widely Recyclable’ Label Really Means (gizmodo.com)

2026-04-02 | get Starbucks Reusable Cup → | tags: starbucks, widely recyclable, packaging

69.

Global semiconductor foundry market hit a record $320 billion in 2025 as TSMC pulled further ahead (tomshardware.com)

2026-04-02 | by Luke James | get TSMC Silicon Chip Kit → | tags: tsmc, semiconductor foundry, ai gpus

70.

You Know How Scientists Keep Finding Microplastics Literally Everywhere? Well, You’d Never Guess What Their Lab Gloves Are Coated in Straight Out of the Packaging (futurism.com)

2026-03-31 | by Victor Tangermann | get Nitrile Disposable Gloves → | tags: microplastics, university of michigan, analytical methods

71.

A new manufacturing process uses lasers to seal paper packaging instead of glue (theverge.com)

2026-03-30 | by Andrew Liszewski | get Laser Sealing Kit → | tags: fraunhofer, papure, carbon monoxide laser

72.

A laser-based process that enables adhesive-free paper packaging (news.ycombinator.com)

2026-03-28 | get Laser Paper Cutter → | tags: laser micro processing, fraunhofer iws, laser-based packaging

73.

Sealing Paper Packaging Without Adhesives (news.ycombinator.com)

2026-03-28 | get Wax Paper Food Wrap → | tags: laser micro processing, fraunhofer iws, fusible cleavage products

74.

Why Thermal Metrology Must Evolve for Next-Generation Semiconductors (spectrum.ieee.org)

2026-03-23 | get Infrared Thermal Camera → | tags: semiconductor architectures, chiplet-based design, 3d stacking

75.

Are We Really Saving the Planet with ‘Organic Cotton’ T‑Shirts Still Smothered in Plastic? (feeds.feedburner.com)

2026-03-17 | by Vishal Vivek | get Organic Cotton T-Shirt → | tags: organic cotton, plastic waste, polybags

76.

4 Kitchen Utensils That Could Be Leaking Microplastics Into Your Meals (cnet.com)

2026-03-15 | by See Full Bio | get Silicone Cooking Utensil Set → | tags: microplastics, plastic containers, food packaging

77.

Future AI chips could be built on glass (technologyreview.com)

2026-03-13 | by Jeremy Hsu | get Glass AI Chip Kit → | tags: amd, intel, glass substrates

78.

Packaging a Gleam app into a single executable (news.ycombinator.com)

2026-03-02 | get Applet → | tags: erlang, gleam, rust

79.

Men in their 50s may be aging faster due to toxic 'forever chemicals' (news.ycombinator.com)

2026-02-26 | by Sandee Lamotte | get Plasticizers → | tags: pfas, epigenetic aging, china's shanghai jiao tong university

80.

Magical Mushroom – Europe's first industrial-scale mycelium packaging producer (news.ycombinator.com)

2026-02-23 | get Mycelium Packaging → | tags: mycelium packaging, mushroom packaging, europe

81.

How to Review an AUR Package (news.ycombinator.com)

2026-02-17 | by Bert Peters | get OpenVINO → | tags: arch, build, install

82.

Corsair redesigns DDR5 packaging to combat rising RAM scams (techspot.com)

2026-02-14 | get DDR5 → | tags: corsair, dd5, ram scams

83.

Corsair fights back against RAM scammers and thieves with packaging shift — ditches iconic yellow boxes for transparent plastic and anti-tampering labels (tomshardware.com)

2026-02-12 | by Zhiye Liu | get RAM → | tags: clamshell, corsair, memory

84.

G.Skill settles with plaintiffs following $2.4 million class action lawsuit over advertised memory speeds, denies all wrongdoing — company will have to change its packaging and be clearer about overclocking and BIOS adjustments if approved (tomshardware.com)

2026-02-10 | by Stephen Warwick | get Memory → | tags: class, court, january

85.

China moves into manufacturing disruptive new semiconductor glass substrates as processor packaging competition intensifies (tomshardware.com)

2026-01-30 | by Luke James | get Semiconductor glass substrates → | tags: chinese, core, glass

86.

Apple and Nvidia considering Intel for 2028 chip production, report claims — non-core products may be outsourced, driven by tariffs and geopolitical concerns (tomshardware.com)

2026-01-28 | by Anton Shilov | get GPU → | tags: apple, foveros, intel

87.

How we made Python's packaging library 3x faster (news.ycombinator.com)

2026-01-16 | by Henry Schreiner | get Package Manager → | tags: faster, python, release

88.

SK hynix to spend $13 billion on the world's largest HBM memory assembly plant amid the worst shortage on record — South Korea facility to handle packaging and testing for AI memory campus (tomshardware.com)

2026-01-14 | by Anton Shilov | get HBM → | tags: hynix, memory, packaging

89.

AI chip design is pushing advanced chip packaging to its limits – workarounds exist for limits of 2.5D packaging, but are years away from viability (tomshardware.com)

2026-01-14 | by Luke James | get Microchip → | tags: active, bridges, cost

90.

SK Hynix doubles down on high-bandwidth memory with $12.9 billion packaging plant (techspot.com)

2026-01-14 | get Memory → | tags: advanced, advanced chip, announced