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1.

Intel reportedly in talks with Google and Amazon over advanced packaging — major customers could take advantage of EMIB-T later this year (tomshardware.com)

2026-04-07 | by Luke James | get Intel EMIB-T Packaging Kit → | tags: intel, google, amazon

2.

Apple and Nvidia considering Intel for 2028 chip production, report claims — non-core products may be outsourced, driven by tariffs and geopolitical concerns (tomshardware.com)

2026-01-28 | by Anton Shilov | get GPU → | tags: apple, foveros, intel

3.

TSMC's CoWoS packaging capacity reportedly stretched due to AI demand — Intel's EMIB and Foveros eyed as potential solution to bottleneck (tomshardware.com)

2025-11-25 | by Luke James | get CoWoS → | tags: cowos, emib, foveros

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