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1.

TSMC's CoWoS packaging capacity reportedly stretched due to AI demand — Intel's EMIB and Foveros eyed as potential solution to bottleneck (tomshardware.com)

2025-11-25 | by Luke James | related products | tags: cowos, emib, foveros

2.

Apple and Broadcom job listings suggest potential Intel Foundry collaborations — requirements highlight expertise in Intel's EMIB and 2.5D memory packaging tech (tomshardware.com)

2025-11-18 | by Aaron Klotz | related products | tags: apple, chips, emib

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