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1.
TSMC's CoWoS packaging capacity reportedly stretched due to AI demand — Intel's EMIB and Foveros eyed as potential solution to bottleneck
(tomshardware.com)
2025-11-25 | by Luke James |
related products
| tags:
cowos
,
emib
,
foveros
2.
Apple and Broadcom job listings suggest potential Intel Foundry collaborations — requirements highlight expertise in Intel's EMIB and 2.5D memory packaging tech
(tomshardware.com)
2025-11-18 | by Aaron Klotz |
related products
| tags:
apple
,
chips
,
emib
Today's top topics:
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