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1.
Intel hires former SK hynix chief Seok-Hee Lee to lead Intel Foundry advanced packaging — company establishing section as 'focused business with dedicated leadership' (tomshardware.com)
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Google reportedly books Intel for packaging more than 3 million TPUs in 2028 — SK hynix is testing Intel's EMIB packaging for HBM integration (tomshardware.com)
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Intel Xeon 6+ ‘Clearwater Forest’ puts 18A in the data center with up to 288 cores, 576 MB of L3 cache — new Xeon 6990E+ is 30% faster per thread than 192-core AMD Epyc 9965, says Intel (tomshardware.com)
4.
Intel, SK hynix shares surge following reports of chip packaging partnership — SK is said to be testing Intel's 2.5D EMIB for HBM integration (tomshardware.com)
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Intel's EMIB-T packaging technology set for fab rollout this year — as TSMC CoWoS capacity remains limited,EMIB-T is preparing for advanced AI accelerator designs (tomshardware.com)
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Intel reportedly in talks with Google and Amazon over advanced packaging — major customers could take advantage of EMIB-T later this year (tomshardware.com)
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TSMC's CoWoS packaging capacity reportedly stretched due to AI demand — Intel's EMIB and Foveros eyed as potential solution to bottleneck (tomshardware.com)
8.
Apple and Broadcom job listings suggest potential Intel Foundry collaborations — requirements highlight expertise in Intel's EMIB and 2.5D memory packaging tech (tomshardware.com)
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