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1.
Are We Really Saving the Planet with ‘Organic Cotton’ T‑Shirts Still Smothered in Plastic? (feeds.feedburner.com)
2.
4 Kitchen Utensils That Could Be Leaking Microplastics Into Your Meals (cnet.com)
3.
Future AI chips could be built on glass (technologyreview.com)
4.
Men in their 50s may be aging faster due to toxic 'forever chemicals' (news.ycombinator.com)
5.
Magical Mushroom – Europe's first industrial-scale mycelium packaging producer (news.ycombinator.com)
6.
How to Review an AUR Package (news.ycombinator.com)
7.
Corsair redesigns DDR5 packaging to combat rising RAM scams (techspot.com)
8.
Corsair fights back against RAM scammers and thieves with packaging shift — ditches iconic yellow boxes for transparent plastic and anti-tampering labels (tomshardware.com)
9.
China moves into manufacturing disruptive new semiconductor glass substrates as processor packaging competition intensifies (tomshardware.com)
10.
Apple and Nvidia considering Intel for 2028 chip production, report claims — non-core products may be outsourced, driven by tariffs and geopolitical concerns (tomshardware.com)
11.
SK hynix to spend $13 billion on the world's largest HBM memory assembly plant amid the worst shortage on record — South Korea facility to handle packaging and testing for AI memory campus (tomshardware.com)
12.
SK hynix to build first U.S. packaging plant for HBM — plugs critical hole in U.S. supply chain, $3.9B investment challenges TSMC and reshapes AI supply chains (tomshardware.com)
13.
SK hynix expands U.S. presence with new Bellevue, Seattle office in efforts to get closer to its largest customers — offices near Nvidia, Amazon, and Microsoft highlight co-designed HBM efforts (tomshardware.com)
14.
Rapidus explores panel-level packaging on glass substrates for next-generation processors — aggressive plan would help it leapfrog rivals (tomshardware.com)
15.
Apple in early talks to assemble and package iPhone chips in India: report (9to5mac.com)
16.
TSMC could be inching closer to making 'all American' chips — report says it is accelerating an advanced packaging facility in Arizona (tomshardware.com)
17.
TSMC's CoWoS packaging capacity reportedly stretched due to AI demand — Intel's EMIB and Foveros eyed as potential solution to bottleneck (tomshardware.com)
18.
Eating Microwave Popcorn in 2025? You Can Do Better (wired.com)
19.
Gizmodo Science Fair: A Non-Toxic Alternative to ‘Forever Chemicals’ (gizmodo.com)
20.
Could aluminium become the packaging 'champion'? (feeds.bbci.co.uk)
21.
Thawing vacuum-packed fish correctly (2024) (news.ycombinator.com)
22.
Debcraft – Easiest way to modify and build Debian packages (news.ycombinator.com)
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