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1.
Imec's 2026 roadmap details 0.3nm nodes by 2038, CFET transistors become viable at 0.7nm — company redefines Moore's Law as cell sizes gain importance for density (tomshardware.com)
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TSMC is reportedly hiking prices for 'all advanced nodes,' accounting for 74% of the company’s wafer business — Nvidia, AMD, Apple, Qualcomm, and others will face higher wafer costs (tomshardware.com)
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TSMC ups revenue guidance and CapEx, buoyed by 'multiyear AI megatrend' — warns Middle East conflict may impact profitability as costs increase (tomshardware.com)
4.
Superconductivity and electronic structures of nickelate thin film superstructures (feeds.nature.com)
5.
Why TSMC grew four times faster than its foundry rivals in 2025 — price hikes, vertical integration, and commanding technology lead pay dividends (tomshardware.com)
6.
Structural modifications in strain-engineered bilayer nickelate thin films (feeds.nature.com)
7.
Author Correction: Signatures of ambient pressure superconductivity in thin film La<sub>3</sub>Ni<sub>2</sub>O<sub>7</sub> (feeds.nature.com)
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TSMC's 3nm capacity is now reserved for its biggest customers only (techspot.com)
9.
Introducing Gemma 3n (news.ycombinator.com)
10.
Next year’s Tensor G6 could be an even larger leap forward than the Pixel 10’s Tensor G5 (androidauthority.com)
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