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1.
Chinese fab SMIC's 7nm metal pitch beats Intel 18A but lags 38% on density, teardown finds — Huawei's sanctions-beating HiSilicon Kirin 9030 is the first subject of SemiAnalysis's new teardown lab (tomshardware.com)
2.
Huawei's ‘Chip Queen’ Throws Down the Gauntlet (wired.com)
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