CXMT begins mass production of 5th-gen DRAM using quadruple-patterning lithography

Chinese memory maker CXMT has started mass-producing chips built on its new G5 process, which shrinks the DRAM active-area half-pitch to 11.95nm through quadruple-patterning lithography and uses storage capacitors with a 45:1 depth-to-width ratio. The first products, 24Gb LPDDR5X chips offering 50% more capacity than CXMT's prior generation, are already shipping in two package formats and appearing in mainstream Chinese flagship smartphones.