GoKawiil
Tech News
ChangXin Memory Technologies (CXMT) announced at the 2026 World Manufacturing Convention that it has begun mass production of its fifth-generation DRAM platform, called G5. The company says the platform uses new self-aligned quadruple patterning with an 11.95nm active-area half-pitch, a 45:1 capacitor aspect ratio, and a high-k metal gate process, delivering roughly 50% more die per wafer than prior generations.
Chinese memory maker CXMT has started mass-producing chips built on its new G5 process, which shrinks the DRAM active-area half-pitch to 11.95nm through quadruple-patterning lithography and uses storage capacitors with a 45:1 depth-to-width ratio. The first products, 24Gb LPDDR5X chips offering 50% more capacity than CXMT's prior generation, are already shipping in two package formats and appearing in mainstream Chinese flagship smartphones.
According to Reuters sources, Chinese DRAM maker CXMT is considering building an experimental 3D NAND production line at its planned second facility near Beijing, which has yet to break ground. The company has also set up a Beijing research institute reportedly working on NAND flash development, and has discussed potential NAND supply with at least one prospective customer targeting AI storage products. CXMT has not officially confirmed any of these NAND ambitions.
Chinese high-purity quartz maker Jiangsu Pacific Quartz, which already supplies furnace tubes and wafer boats to Lam Research and Tokyo Electron, has had its quartz components certified by a Chinese DRAM producer believed to be CXMT for 300mm wafer production. The materials meet the 4N5–5N purity level needed for semiconductor process equipment, giving China a more domestic supply chain for chipmaking consumables.
Apple is said to be considering ChangXin Memory Technologies (CXMT), a fast-growing Chinese DRAM maker, as a potential supplier for some of its China-related memory needs. CXMT has not confirmed Apple by name but says it is open to working with top global customers and claims its products can compete with established suppliers on performance and reliability. The move would give Apple added leverage in talks with existing suppliers Micron, Samsung, SK Hynix and Kioxia.
Chinese memory chipmaker CXMT told investors it is expanding its foothold in premium memory-chip segments, pointing to progress in smartphone and AI-related chip technologies as evidence. The company framed these advances as proof it is closing the gap with established global memory manufacturers.
South Korean court documents allege that Chinese memory maker CXMT ran an internal program called Project Hefei, led by a former Samsung DRAM development chief, to systematically acquire Samsung's manufacturing know-how starting in 2016. Prosecutors say the plan involved poaching Samsung engineers, obtaining a 620-step Process Recipe Plan detailing equipment and production methods, and using it to launch DRAM wafer production by 2018.
ChangXin Memory Technologies, the Hefei-based DRAM maker, has filed suit against the Department of Defense seeking removal from its list of companies linked to China's military. CXMT argues its chips are civilian memory products built to JEDEC standards, and that the Pentagon's classification lacks factual or legal support. The DoD briefly announced plans to delist CXMT earlier this year before reversing that decision.