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Nanya-backed PieceMakers debuts on Taiwan exchange, targets AI inference memory niche

PieceMakers, a DRAM designer majority-owned by Nanya Technology, began trading on Taiwan's Emerging Stock Board at a NT$740 reference price and closed its first session up 23.6% at NT$915, valuing the company near $1.4 billion. Rather than competing in HBM, the firm is pursuing custom memory designs that bond DRAM directly to processors via hybrid bonding, positioning the technology between SRAM-only chips like Nvidia's Groq LPU and traditional HBM for AI inference workloads.

SK hynix delays hybrid bonding for HBM until HBM5, cites 775-micron package limit

At Hot Chips 2026, SK hynix's Jaesik Lee said hybrid bonding won't be ready in time for HBM4E and will instead debut with HBM5, as current HBM4 packages are already constrained by a 775-micron thickness ceiling matching standard logic wafers. To keep scaling within that limit, 16-Hi HBM4 stacks now use dies thinned to about 50 microns with half the interlayer gap of 12-Hi designs, while SK hynix continues using its existing MR-MUF bonding method through upcoming Nvidia Rubin-generation products.

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